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Arbitrary Modeling of TSVs for 3D Integrated Circuits

Alaa El-Rouby , Yehea Ismail , Khaled Salah

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers...

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